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Carrier Board - D137

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D137 Stacking Design Carrier Board [NEW]

NVIDIA® Jetson Orin NX  

For Defense-grade unmanned aircraft/Radar Applications

  • 2x Ethernet GH1.25/ 8 pin Wafer
  • 1 x Micro HDMI output (HDMI 1.4, 1080P)
  • 2 x 4 lane MIPI CSI-2
  • 22 pin FPC 0.5mm Pitch/GMSLCamera Inputs
  • 1x USB 2.0 Type C (For BSP Installation)
  • 3x USB 3.2 Type C
  • 1x M.2. key M 2230 forNVMe
  • XT30 DC-IN 12V~50V
  • Operating Temperature:  -10°C~60°C(Board Level)
  • Dimension:  90mm (L) x 56mm (W) x 30.7mm (H) (Stacking with SOM)

Overview

 

The Carrier Board is a compact, high-density platform built around the NVIDIA® Jetson Orin NX module. Delivering AI performance in space- and weight-constrained designs. Its small size and robust layout make it well suited for defense-grade unmanned aircraft, radar and other edge systems. With native GMSL2 and MIPI CSI-2 camera interfaces, the carrier board supports flexible multi-camera configurations, from long-range zoom and low-light sensors to wide-angle situational-awareness views. This enables rich computer-vision workloads such as object detection, tracking, and perception directly at the edge.

 

 

Specifications

Model

D137

NVIDIA Module Compatibility 

NVIDIA® Jetson Orin NX module

Networking

2x Ethernet GH1.25/ 8 pin Wafer (10/100/1000/Gigabit Ethernet)

Display Output

1 x Micro HDMI output (HDMI 1.4, 1080P)

MIPI Camera Inputs 

2 x 4 lane MIPI CSI-2, 22 pin FPC 0.5mm Pitch/GMSL Camera Inputs 

USB

1x USB 2.0 Type C (For BSP Installation)

3x USB 3.2 Type C

Storage

1x M.2. key M 2230 for NVMe

Expansion Connector

4x UART GH1.25/4pin Wafer

1x Expansion Power Button GH1.25/2pin Wafer

1x Expansion Suspend/Wakeup GH1.25/2pin Wafer

1x Expansion Recovery GH1.25/2pin Wafer

1x CAN Bus GH1.25/ 4 pin wafer 

2x SPI GH1.25/6 pin wafer

1x PWMs*4 GH1.25/6pin Wafer

2x I2C (Master) GH1.25/4pin Wafer 

1x GPIOs*8 GH1.25/10pin Wafer

RTC Battery

Support RTC battery and Battery Life Monitoring by MCU

Internal Buttons

Power and Recovery and Suspend/Wakeup

Thermal solution

4 pin Fan Wafer solution

Power Input

XT30 DC-IN 12V~50V 

Temperature

Operating Temperature -10°C~60°C (Board Level)

PCB/Electronics Mechanical Info

90mm (L) x 56mm (W) x 30.7mm (H) (Stacking with SOM)

Weight

80g

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Date : 2026-07-09 00:00:00

D137 carrier board datasheet v0.1
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  • AVerMedia Home
  • Products
    • Embedded Systems by Type
      • Carrier Board
      • Single Board Computer
      • Box PC
      • Engineering Kit
      • Peripheral
    • Embedded Systems by NVIDIA Jetson Module
      • AGX Thor
      • Super Mode
      • Orin NX
      • Orin Nano
      • AGX Orin
      • AGX Xavier
      • Xavier NX
      • TX2 NX
    • Embedded Systems by Qualcomm
      • Dragonwing
    • Frame Grabbers
      • M.2
      • Mini
      • PCIe
      • USB
    • Out-of-Band Management
      • ERMI Series
    • AI Fusion Kit
      • AI Fusion Kit Series
    • SenseEdge Development Kit
      • SenseEdge Development Kit (GMSL Series)
  • Integration
    • Quality
    • Security
    • Manageability
    • Vision Compatibility
  • Customize
    • Customize Your Product
  • Applications
    • Use Cases
  • Ecosystem Partners
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