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Peripheral - 5G set

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5G set

The 5G Module Set is designed providing flexible and efficient solutions for embedded systems and IoT applications. It features M.2 B key 3052 slots to accommodate 5G Sub-6 modules, enabling high-speed wireless connectivity.

Specifications

Model

5G set

Applicable 

product

D133 (5G) 、D115W (5G)、D315 (5G)
D135 (Antenna refer to here)

Software

Driver is included

 

Specification

Quectel RM520N-GL 5G Sub-6 Module

Dimensions: 52mm × 30mm × 2.3mm

Connector interface: M.2 B key 3052

 

Temperature

Operating temperature  -40 °C ~ 85 °C

Storage temperature -40°C ~ 85°C

Package

1x Quectel RM520N-GL

4x 617MHZ~5.85GHz Antenna with SMA/M

4x I-PEX MHF4L/M TO SMA/F cable

* All specifications are subject to change without prior notice.

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Date : 2025-06-20 00:00:00

5G Set Datasheet
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  • Products
    • Embedded Systems by Type
      • Carrier Board
      • Single Board Computer
      • Box PC
      • Engineering Kit
      • Peripheral
    • Embedded Systems by NVIDIA Jetson Module
      • Super Mode
      • Orin NX
      • Orin Nano
      • AGX Orin
      • AGX Xavier
      • Xavier NX
      • TX2 NX
    • Embedded Systems by Qualcomm
      • Dragonwing
    • Frame Grabbers
      • M.2
      • Mini
      • PCIe
      • USB
    • Out-of-Band Management
      • ERMI Series
    • AI Fusion Kit
      • AI Fusion Kit Series
    • SenseEdge Development Kit
      • SenseEdge Development Kit (GMSL Series)
  • Integration
    • Quality
    • Security
    • Manageability
    • Vision Compatibility
  • Customize
    • Customize Your Product
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    • Use Cases
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