SiMa.ai's MLSoC
For drone applications
Turn AI Ambition Into Flight-Ready Reality
Built for the demanding SWaP requirements of drones, the integrated AVerMedia and SiMa.ai solution combines production-ready hardware, 50 TOPS of AI performance under 10W, and SiMa.ai’s Palette Neat development environment. The result: less hardware integration, faster AI development, and a more direct path from prototype to commercial deployment—helping drone developers build smarter, lighter, and more power-efficient systems faster.
Model | D137SM |
|---|---|
Module Compatibility | SiMa.ai's MLSoC |
Networking | 2x Ethernet GH1.25/ 8 pin Wafer (10/100/1000/Gigabit Ethernet) |
Display Output | 1 x Micro HDMI output (HDMI 1.4, 1080P) |
MIPI Camera Inputs | 2 x 4 lane MIPI CSI-2, 22 pin FPC 0.5mm Pitch/GMSL Camera Inputs |
USB | 1x USB 2.0 Type C (For BSP Installation) 3x USB 3.2 Type C |
Storage | 1x M.2. key M 2230 for NVMe |
Expansion Connector | 4x UART GH1.25/4pin Wafer 1x Expansion Power Button GH1.25/2pin Wafer 1x Expansion Suspend/Wakeup GH1.25/2pin Wafer 1x Expansion Recovery GH1.25/2pin Wafer 1x CAN Bus GH1.25/ 4 pin wafer 2x SPI GH1.25/6 pin wafer 1x PWMs*4 GH1.25/6pin Wafer 2x I2C (Master) GH1.25/4pin Wafer 1x GPIOs*8 GH1.25/10pin Wafer |
RTC Battery | Support RTC battery and Battery Life Monitoring by MCU |
Internal Buttons | Power and Recovery and Suspend/Wakeup |
Thermal solution | 4 pin Fan Wafer solution |
Power Input | XT30 DC-IN 12V~50V |
Temperature | Operating Temperature -10°C~60°C (Board Level) |
PCB/Electronics Mechanical Info | 90mm (L) x 56mm (W) x 30.7mm (H) (Stacking with SOM) |
Weight | 80g |