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ERMI Series - ERMI Module

Overview
Where to Buy

Edge Remote Management Interface (ERMI) Module

The ERMI Out-Of-Band (OOB) Management Module is a complete solution that provides remote device management services. 

Applications:

-  Power cycling

-  Serial console

-  M.2. B key slot for 4G module (optional)

-  Key functions: Power Actions; Remote Terminal (SOL) Access; Virtual Media

Overview

 

Conquer the final challenge of your edge AI projects: seamless deployment and scalable management. The ERMI Out-Of-Band (OOB) Management Module is a complete solution that provides remote device management services.

 

In the event of an edge system malfunction and subsequent shutdown, the OOB function can be utilized to power the system back on and verify whether the device has resumed normal operations. The ERMI Module offers customers a customizable cloud-based device management portal for easily controlling all edge devices remotely.

Specifications

Model

Out-Of-Band (OOB) Management Module

Applicable 

product

D133/D133S

D115W/D115S

D135

 D131/D131L/D131S

D315 / D315AOB / D315AOP

System

Nuvoton NUC980

Device 

Management

Enables remote monitoring and management, swift disaster recovery, and seamless access to serial console (SOL)

 and Virtual Media functions via the ERMI API

Enables remote monitoring and management and swift disaster recovery via the ERMI API

External I/O

•1 x RJ45 10/100Mb (LED indicator)

•1 x Micro SIM slot for 4G module*

Internal I/O

•1 x 15pin wafer for PWB、RST、5V、3V3、 

     Sys Debug UART、I2C、auto-  link UART、

     Power detecting pin、 GPIO

•1 x 10pin wafer for NCSI (supported by D115W & D135)**

•1 x reset button

•1 x DIP switch for function setting

•1 x USB type-C for MCU update

•1 x 2pin wafer for SSD recovery (TBD)**

•1 x 15pin wafer for PWB、RST

•1 x reset button

•1 x DIP switch for function setting

•1 x USB type-C for MCU update

•1 x 2pin wafer for SSD recovery (TBD)***

 

Expansion

•1 x M.2 Key. B 3042 (only USB2.0) for 4G module*

NA

Power 

Input

5V power

3V3 power

Environment

•Operating temperature  -40°C ~ 85°C  (TBD, The actual situation depends on the box PC spec. )

•Storage temperature -40°C ~ 85°C

Mechanical

 55 x 56.2mm

Package

•ERMI Module

•Cable

•Screws

* We will support this feature upon customer request.

**The 10pin wafer on D131/D131L/D315 doesn't support NCSI.

***  The 2-pin wafer is for Apacer's SSD recovery function.

**** All specifications are subject to change without prior notice.

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  • Products
    • Embedded Systems by Type
      • Carrier Board
      • Single Board Computer
      • Box PC
      • Engineering Kit
      • Peripheral
    • Embedded Systems by NVIDIA Jetson Module
      • Super Mode
      • Orin NX
      • Orin Nano
      • AGX Orin
      • AGX Xavier
      • Xavier NX
      • TX2 NX
    • Embedded Systems by Qualcomm
      • Dragonwing
    • Frame Grabbers
      • M.2
      • Mini
      • PCIe
      • USB
    • Out-of-Band Management
      • ERMI Series
  • Integration
    • Quality
    • Security
    • Manageability
    • Vision Compatibility
  • Customize
    • Customize Your Product
  • Applications
    • Use Cases
  • Ecosystem Partners
    • Partner List
  • Support
    • Downloads & FAQ
    • Technical Support
    • Developer Portal
    • Warranty & RMA Services
    • EOL Notification
    • Where to Buy
  • About
    • About AVerMedia
    • News
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    • Contact
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