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Carrier Board - D317 (AGX Orin/AGX Orin Industrial)

概要 ダウンロード
購入先

D317

Applies  NVIDIA® Jetson AGX Orin 

  • Applies to NVIDIA® Jetson AGX Orin module
  • 1x GbE RJ-45
  • 2x NVMe M.2 Key M 2280 (1x only support S1 Type Top side component SSD)
  • 1x M.2 Key E 2230 for WIFI 6
  • 1x HDMI 2.0 (3840x2160 at 60Hz)
  • 1x 120pin for GMSL camera board
  • 1x USB 3.2 Type-C for BSP install
  • Optional 2x 10G RJ-45 (via daughter board)
  • Optional 8x PoE (via daughter board)
  • Optional 1x M.2 Key B for 5G connection (via daughter board)
  • Operating temperature: -40 to 85°C (carrier board) (TBD)
  • Dimension: W: 92mm x L: 107mm (TBD)

Overview

 

AVerMedia Carrier Board D317 support NVIDIA® Jetson AGX Orin , which brings next-level AI performance and power-efficient capability for all autonomous machines. This optional SoM makes advanced analytics possible while providing the ability to handle a host of other embedded IoT applications.

 

D317 includes a 120-pin high-speed connector for connecting MIPI SerDes cameras, which can fulfill the demand for AMRs. In addition, a sufficient Ethernet bandwidth with 10G is excellent for applying smart security, enabling dozens of IP cameras to stream simultaneously. The connector for the 10GigE Vision Camera is also great for smart inspection. Lastly, with its compact size, D315 5G furnishes a PCIe slot for multi-function expansion and excellent compatibility with 5G and Wi-Fi 6.

Key Industries

 

AVerMedia devices are built with flexibility in mind and are designed for the following verticals.

AMRs

 

AMRs deployment relies on live camera feeds to provide a rapid and flexible adjustment for the working process and creates a significant productivity growth.

Smart Security

 

Smart security relies on live camera feeds to benefit from the video analysis to improve and ensure community safety.

Smart Inspection

 

Smart inspection relies on live camera feeds to benefit from fast and accurate detection to improve quality control in production.

Specifications

Model

D317

NVIDIA GPU SoC Module Compatibility

NVIDIA® Jetson AGX Orin module

Networking

•1x GbE RJ-45

•1 x M.2 key E 2230 for wifi 6

•Optional 2x 10G RJ-45 (via daughter board) (TBD)

•Optional 8x PoE (via daughter board) (TBD)

•Optional 1x M.2 Key B for 5G connection (via 5G、PoE/5G、USB/5G daughter board) (TBD)

Display Output

1 x HDMI output 3840 x 2160 at 60Hz


Temperature

•Operating temperature: -40 to 85°C (carrier board), -20 to 70°C (with fan) (TBD)

•Storage temperature -40°C ~ 85°C  (TBD)

•Relative humidity 40 °C @ 95%, Non-Condensing

Camera Inputs

1x 120pin for GMSL camera board

USB

•1x USB 3.2 Type-C for BSP install 

(supports OTG mode,when using with PoE/5G daughter board or USB/5G daughter board, 

the USB 3.2 OTG port becomes USB 2.0)

•1x USB 3.2 Type-C (host mode only)

•Optional 8x USB3.2 Type-A (via daughter board) (TBD)

Storage

2x NVMe M.2 Key M 2280 (1x only support S1 Type Top side component SSD)

TPM 

(Trusted Platform Module)

•Built in Infineon SLB 9672 TPM Chip

 

 

 

Expansion Header

•30pin header: 1xUART, 1xI2C, 3xGPIO,1xSPI, 2xCAN BUS, 1xI2S, 5V(Maximum 0.7A), 3.3V(Maximum 0.7A)

•12pin header: 1x12V(Maximum 0.7A), 1x5V(Maximum 1A), 1x3.3V(Maximum 1A) power Output, 1xUSB 2.0, 1xDMIC

•16pin wafer for OOB or External Button:

       -OOB: 1xUART, 1xDebug UART, 1xPower button, 1xReset button,

       1x Power detect (via out-of-band management module)

       -External Buttons: 1xPower Button, 1xReset button, 1xRecovery button,

       1xPWR_LED (via external button cable)

•40pin coaxial connector for 10G expansion

•40pin coaxial connector for PCIe expansion

GPS

Optional Dual-RTK GNSS support (via daughter board)

Sensor

Temperature sensor for PCB top/bot Temperature measure

Power requirement

Mini-Fit 4pin compatible ,12V +/- 5% DC Input

Thermal Solution

Fan solution (12V fan wafer)

Buttons

Power and Recovery

 

LED

1x system power
1x input power

RTC Battery

Support RTC battery and battery life monitoring by MCU

PCB/Electronics Mechanical Info

•W: 92mm x L: 107mm (TBD)

•Weight: 150g (TBD)

Certifications

CE, FCC, VCCI,KC

Package

1x Carrier board

Screws

Nuts

Ordering Information

Model

Part Number

SKU Number

Support NVIDIA SOM

D317

61D3170001AC

D317-001

AGX Orin 32G/ 64G / Industrial

Optional Accessory

Item

Part Number

Product Name

Type

Description

Remark

1

61D317USB1AJ

USB Board

Board

Support 8xUSB port and 1xM.2 Key B for 4G/5G Module

 

2

61D317TG01AX

10G board

Board

Support 2x10G port 

 

3

61F8P1M001AB

8x PoE board

Board

Support 8xPoE port and 1xM.2 Key B for 4G/5G Module

 

4

61D1350001AK

RTK GNSS module

Board

U-blox ZED-F9P+F9H

 

5

61D317OB01AK

ERMI module

Board

Support remote device management services

 

6

61D317GM01AF

GMSL Board

Board

Support 8x GMSL camera via mini fakra cable

 

7

60D3170001AB

Mini FAKRA cable

Cable

Support standard FAKRA x4 for connecting to GMSL board

 

8

60D3170001AC

12pin Flying Leads Cable

Cable

Support connection to the 12-pin port (J71) on the D317 board

 

9

60D3170001AD

16pin Flying Leads Cable

Cable

Support connection to the 16-pin port (J32) on the D317 board

 

10

60D3170001AE

30pin Flying Leads Cable

Cable

Support connection to the 30-pin port (J70) on the D317 board

 

11

51D115SEX1AJ

5G daughter board

Board

Support 1xM.2. M key for SSD and 1xM.2 B key for 4G/5G

 

12

0700WLAN0AWX

Wi-Fi 6E AX210 set

Board

Wi-Fi 6E-intel AX210 (include 1xcable and 2xantennas)

 

13

60D3150000AE

4G set

Board

Quectel EM05_LTE Cat 4 M.2 Module+2xCable+2xAntenna

Need 5G daughter board

15

60D3150001AD

5G set

Board

Quectel RM520N Series_5G Sub-6 GHz M.2

Module+4xCable+4xAntenna

Need 5G daughter board

ダウンロード

2D drawing
3D drawing
APPRO
BSP
BSP for AGX Orin
BSP for Nano
BSP for NX
BSP for Orin Nano
BSP for Orin NX
BSP for TX2 NX
BSP Version Update
D3 Embedded
Daemon
Datasheet
Datasheet
Datasheet
Datasheet
Driver
FAQ
Fireware
Firmware
Mechanical
ORBBEC
RealSense
SDK and Capture Studio
Sensing
Source code
Stereolabs
TIER IV
User Manual

Date : 2026-04-09 00:00:00

D317 User Manual V0.5

Date : 2026-03-24 00:00:00

OS Version Compatible SoMs Release Note
L4T r36.4.4 (Jetpack 6.2.2) AVERMEDIA_JETPACK-R1.4.0.6.2.2 AGX Orin
Orin NX & Orin Nano
Orin Nano Super Mode
Orin NX Super Mode
ReadMe

Date : 2025-09-11 00:00:00

OS Version Compatible SoMs Release Note
L4T r36.4.4 (Jetpack 6.2.1) AVERMEDIA_JETPACK-R1.2.3.6.2.1 AGX Orin
Orin NX & Orin Nano
Orin Nano Super Mode
Orin NX Super Mode
ReadMe

Date : 2025-09-23 00:00:00

D317 User Manual

Date : 2025-05-16 00:00:00

D317 carrier board 2D Drawing

Date : 2025-05-16 00:00:00

D317 carrier board 3D Drawing

Date : 2025-05-07 00:00:00

 
OS Version Compatible SoMs Release Note
L4T r36.4.3 (Jetpack 6.2) AVERMEDIA_JETPACK-R1.1.4.6.2.0 (Beta)

AGX Orin
Orin NX & Orin Nano
Orin Nano Super Mode
Orin NX Super Mode

ReadMe

Date : 2025-11-25 00:00:00

D317 Carrier Board

Date : 2025-02-25 00:00:00

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Copyright © AVerMedia.
  • 製品情報
    • 組み込みシステム一覧
      • キャリアボード
      • シングルボード・コンピュータ
      • ボックスPC
      • エンジニア・キット
      • ペリフェラル
    • NVIDIA Jetson 組み込みシステム
      • AGX Thor
      • Super Mode
      • Orin NX
      • Orin Nano
      • AGX Orin
      • AGX Xavier
      • Xavier NX
      • TX2 NX
    • Qualcomm 組み込みシステム
      • Dragonwing
    • キャプチャーカード
      • M.2
      • Mini
      • PCIe
      • USB
    • OOB(遠隔管理)ソリューション
      • ERMI Series
    • AI Fusion Kit
      • AI Fusion Kit Series
    • SenseEdge Development Kit
      • SenseEdge Development Kit (GMSLシリーズ )
  • 当社の強み
    • 品質
    • 安全性
    • 管理性
    • 映像互換性
  • カスタマイズ
    • 用途に合わせたカスタマイズ
  • 採用事例
    • 採用事例
  • パートナー
    • パートナー情報
  • サポート
    • ダウンロード・FAQ
    • 技術サポート
    • 開発者ポータル
    • 保証・RMAサービス
    • EOL通知
    • 購入先
  • 企業情報
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